CMC Microsystems

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Country	State	City	Details

Technology :	Open-Gate Silicon JFET, BiCMOS, FinFET, CMOS, BCD
Substrate :	RFSOI, SiGe, FDSOI, Si, GaAs

Package Family :	Die Stacking, Die On Board, Flip Chip Package, Hermetic Packaging, Multi Die Assembly, Photonic Packaging, Wafer Level Vacuum Package, Wire Bond Packaging
Type :	Butterfly Package, CFP, CPGA, CQFP, DIP, QFP, PGA

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